| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 03 | WO/2025/216783 | PIEZOELECTIC DEVICES INCLUDING COMPOUND SEMICONDUCTOR MATERIALS AND A SUPERLATTICE LAYER | US2025/012005 | H01L 21/20 | ATOMERA INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2025/219278 | PLANAR DRIVE SYSTEM AND METHOD FOR OPERATING A PLANAR DRIVE SYSTEM | EP2025/060108 | H01L 21/67 | BECKHOFF AUTOMATION GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2025/223913 | METHOD FOR DETECTING A BLOCKAGE STATE, AND PNEUMATIC SYSTEM | EP2025/060233 | H01L 21/67 | FESTO SE & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2025/223920 | METHOD FOR OPERATING A PNEUMATIC SYSTEM AND PNEUMATIC SYSTEM FOR INDUSTRIAL AUTOMATION | EP2025/060262 | H01L 21/67 | FESTO SE & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2025/223970 | METHOD FOR SYNCHRONOUSLY MOVING AT LEAST TWO ACTUATOR ELEMENTS, AND PNEUMATIC SYSTEM | EP2025/060532 | H01L 21/67 | FESTO SE & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2025/223972 | METHOD FOR OPERATING A PNEUMATIC SYSTEM AND PNEUMATIC SYSTEM FOR INDUSTRIAL AUTOMATION | EP2025/060543 | H01L 21/67 | FESTO SE & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2025/241846 | EMBEDDED PACKAGING STRUCTURE, POWER SUPPLY, AND MANUFACTURING METHOD | CN2025/091751 | H01L 25/16 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011516 | PARTICLE REMOVAL METHOD AND APPARATUS | CN2024/110549 | H01L 21/67 | SHANGHAI CHUANXIN SEMICONDUCTOR CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011552 | CASSETTE DEVICE AND WAFER INSERTING MACHINE | CN2024/118084 | H01L 21/677 | TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011645 | PREPARATION METHOD FOR JUNCTION-LESS TRANSISTOR | CN2024/134141 | H01L 21/76 | GUANGDONG GREATER BAY AREA INSTITUTE OF INTEGRATED CIRCUIT AND SYSTEM | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011710 | MANUFACTURING METHOD FOR THIN FILM RESISTOR AND THIN FILM RESISTOR STRUCTURE | CN2024/143716 | H01L 23/64 | CSMC TECHNOLOGIES FAB2 CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011733 | EMBEDDED PACKAGING STRUCTURE, POWER SUPPLY MODULE AND ELECTRONIC DEVICE | CN2025/071962 | H01L 23/31 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011740 | CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR | CN2025/073041 | H01L 23/31 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011743 | CONNECTION FILM AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR | CN2025/073628 | H01L 23/31 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/011880 | CMOS DEVICE AND MANUFACTURING METHOD THEREFOR | CN2025/089313 | H01L 21/283 | SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MATERIALS INDUSTRY INNOVATION CENTER CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012015 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | CN2025/098923 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012018 | CO-PACKAGED OPTICS STRUCTURE HAVING OPTICAL PORT PROTECTION AND MANUFACTURING METHOD THEREFOR | CN2025/099069 | H01L 21/56 | NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012034 | CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | CN2025/100183 | H01L 23/538 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012110 | EPITAXIAL FILM GROWTH STATE DETECTION METHOD, AND DETECTION SYSTEM | CN2025/102995 | H01L 21/66 | CHUYUN TEK (SHANGHAI) CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012584 | A LEAD FRAME PACKAGE FOR AN RF APPLICATION AND A METHOD OF MANUFACTURING A LEAD FRAME PACKAGE | EP2024/069503 | H01L 23/495 | TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012658 | METHOD FOR PRODUCING A GROWTH SUBSTRATE, METHOD FOR PRODUCING AN EPITAXIAL SILICON CARBIDE LAYER, GROWTH SUBSTRATE, AND EPITAXIAL SILICON CARBIDE LAYER | EP2025/065659 | H01L 21/20 | HITACHI ENERGY LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012661 | APPARATUS FOR HANDLING A WAFER AND METHOD OF HANDLING A WAFER | EP2025/065716 | H01L 21/67 | METRYX LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/012845 | SUBSTRATE CARRIER, SUBSTRATE, AND METHOD FOR COATING A SUBSTRATE | EP2025/068771 | H01L 21/687 | JENOPTIK OPTICAL SYSTEMS GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013063 | MOUNTING DEVICE FOR FLEXIBLE COMPONENTS | EP2025/069450 | H01L 21/67 | FESTO SE & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013130 | APPARATUS AND METHOD FOR NON-IMMERSIVE WET-CHEMICAL TREATMENT OF A SUBSTRATE AND DEVICE FOR HOLDING THE SUBSTRATE | EP2025/069588 | H01L 21/673 | ATOTECH DEUTSCHLAND GMBH & CO. KG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013337 | AN APPARATUS FOR PROCESSING A SURFACE OF A SUBSTRATE | FI2025/050392 | H01L 21/677 | BENEQ OY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013482 | SEMICONDUCTOR DEVICE WITH A JUNCTION IN BACKSIDE POWER DELIVERY NETWORK | IB2025/056493 | H01L 23/528 | INTERNATIONAL BUSINESS MACHINES CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013491 | OXIDANT GAS OR OXIDANT VAPOR GENERATION AND DELIVERY SYSTEMS AND METHODS | IB2025/056649 | H01L 21/67 | RASIRC, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013769 | POWER CONVERSION APPARATUS AND METHOD FOR COOLING POWER CONVERSION APPARATUS | JP2024/024826 | H01L 25/07 | TMEIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013841 | SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE PROCESSING METHOD | JP2024/025103 | H01L 21/304 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013944 | SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE COMPRISING SAME | JP2024/037527 | H01L 23/28 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013962 | SEMICONDUCTOR SYSTEM | JP2025/003699 | H01L 25/00 | MURATA MANUFACTURING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/013999 | SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROGRAM, AND SUBSTRATE PROCESSING APPARATUS | JP2025/012912 | H01L 21/316 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014009 | SUBSTRATE PROCESSING SYSTEM AND INFORMATION PROCESSING DEVICE | JP2025/014777 | H01L 21/304 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014030 | ADHESIVE TAPE FOR ELECTRONIC COMPONENT PROCESSING AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT | JP2025/016496 | H01L 21/301 | DAI NIPPON PRINTING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014096 | SEMICONDUCTOR MODULE | JP2025/019177 | H01L 23/36 | IHI CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014132 | SEMICONDUCTOR DEVICE AND VEHICLE | JP2025/020882 | H01L 25/00 | FUJI ELECTRIC CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014135 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE, AND SILYLATED COMPOSITION | JP2025/021099 | H01L 21/306 | CENTRAL GLASS COMPANY, LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014152 | DEVICE FOR MANUFACTURING POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE | JP2025/021629 | H01L 23/36 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014186 | OXIDE SEMICONDUCTOR THIN FILM, COMPOSITE THIN FILM, AND SPUTTERING TARGET | JP2025/022109 | H01L 21/363 | KOBELCO RESEARCH INSTITUTE, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014200 | APPARATUS FOR PRODUCING CLEANING WATER FOR ELECTRONIC DEVICE, AND METHOD FOR PRODUCING SAID CLEANING WATER | JP2025/022255 | H01L 21/304 | KURITA WATER INDUSTRIES LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014201 | APPARATUS AND METHOD FOR MANUFACTURING CLEANING WATER FOR ELECTRONIC DEVICE | JP2025/022256 | H01L 21/304 | KURITA WATER INDUSTRIES LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014225 | PATTERN-FORMING DEVICE, PATTERN-FORMING METHOD, AND STORAGE MEDIUM | JP2025/022678 | H01L 21/027 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014228 | ETCHING METHOD AND PLASMA TREATMENT DEVICE | JP2025/022740 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014229 | ETCHING METHOD AND PLASMA TREATMENT DEVICE | JP2025/022743 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014232 | SEMICONDUCTOR DEVICE | JP2025/022767 | H01L 25/07 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014233 | SEMICONDUCTOR DEVICE | JP2025/022768 | H01L 25/00 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014234 | SEMICONDUCTOR DEVICE | JP2025/022769 | H01L 25/07 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014248 | IMAGE PROCESSING SYSTEM, INSPECTION SYSTEM, AND IMAGE PROCESSING METHOD | JP2025/022935 | H01L 21/66 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014263 | PLASMA PROCESSING DEVICE, METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK, AND METHOD FOR REGENERATING ELECTROSTATIC CHUCK | JP2025/023150 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014278 | HEIGHT ADJUSTMENT TOOL | JP2025/023278 | H01L 21/027 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014290 | SUBSTRATE PROCESSING DEVICE | JP2025/023456 | H01L 21/027 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014316 | COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE | JP2025/023656 | H01L 21/02 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014325 | SEMICONDUCTOR DEVICE | JP2025/023785 | H01L 25/07 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014335 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | JP2025/023868 | H01L 21/66 | HAMAMATSU PHOTONICS K.K. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014399 | PROTECTIVE SHEET | JP2025/024290 | H01L 21/683 | NITTO DENKO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014430 | COMPOSITION FOR FORMING COATING FILM FOR FOREIGN SUBSTANCE REMOVAL AND SEMICONDUCTOR SUBSTRATE | JP2025/024446 | H01L 21/304 | NISSAN CHEMICAL CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014463 | CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD | JP2025/024617 | H01L 23/13 | NITERRA MATERIALS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014507 | ELECTROSTATIC CHUCK MEMBER AND ELECTROSTATIC CHUCK DEVICE | JP2025/024797 | H01L 21/683 | SUMITOMO OSAKA CEMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014513 | CRYSTALLINE OXIDE FILM, THIN FILM TRANSISTOR, AND ELECTRONIC APPARATUS | JP2025/024830 | H01L 21/363 | IDEMITSU KOSAN CO.,LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014760 | HEAT SINK STRUCTURE | KR2025/008702 | H01L 23/467 | LS ELECTRIC CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014763 | LIGHT-EMITTING ELEMENT, AND DISPLAY DEVICE AND ELECTRONIC DEVICE COMPRISING SAME | KR2025/008749 | H01L 25/075 | SAMSUNG DISPLAY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014787 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME | KR2025/009214 | H01L 23/00 | PSK HOLDINGS INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014840 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING DISPLAY DEVICE | KR2025/009743 | H01L 25/075 | SAMSUNG DISPLAY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/014925 | DISPLAY DEVICE, MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE | KR2025/009975 | H01L 25/075 | SAMSUNG DISPLAY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015021 | CARRIER FOR HOLDING ELECTRONIC COMPONENTS DURING VISUAL INSPECTION, VISUAL INSPECTION DEVICE AND INSPECTION METHOD | NL2025/050338 | H01L 21/683 | BESI NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015022 | DEVICE, SYSTEM AND METHOD FOR PUNCHING ELECTRONIC COMPONENTS | NL2025/050339 | H01L 21/67 | BESI NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015183 | SYSTEMS AND METHODS FOR FORMING THERMAL INTERFACE MATERIAL ON SUBSTRATES | US2025/024960 | H01L 21/02 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015192 | CHEMICAL ETCH USING SELECTIVE ION IMPLANTATION | US2025/027950 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015194 | METHOD PROCESSING METAL FEATURES IN A SEMICONDUCTOR SUBSTRATE | US2025/027975 | H01L 21/3213 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015225 | CONDUCTIVE STRUCTURE WITH MULTIPLE SUPPORT PILLARS | US2025/031924 | H01L 23/00 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015261 | PLASMA ENHANCED NUCLEATION LAYER FORMATION | US2025/034384 | H01L 21/768 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015279 | MULTI-LAYERED EPITAXIAL STACK FORMED IN A PRESENCE OF A HIGHER ORDER SILICON PRECURSOR | US2025/034927 | H01L 21/02 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015282 | PACKAGE COMPRISING INTEGRATED DEVICE AND A METALLIZATION PORTION | US2025/034943 | H01L 23/538 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015285 | MOLD COMPOUND EMBEDDED DEVICE COOLING STRUCTURE | US2025/035064 | H01L 23/427 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015312 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH DISCRETE MEMORY ARRAYS AND CMOS DEVICES CONFIGURED FOR EXTERNAL CONNECTION | US2025/035810 | H01L 23/538 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015321 | POWER BASED DISTRIBUTION OF MEMORY OPERATIONS | US2025/035883 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015372 | REMOTE ICR RADICAL DEPOSITION OF TUNABLE LOW-K DIELECTRIC FILMS | US2025/036400 | H01L 21/02 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015391 | MEMORY IN PACKAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS | US2025/036463 | H01L 25/16 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015394 | HIGH DIE STACK PACKAGE WITH VERTICAL DIE-TO-DIE INTERCONNECTS | US2025/036474 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015395 | VERTICALLY INTEGRATED COMPUTING AND MEMORY SYSTEMS AND ASSOCIATED DEVICES AND METHODS | US2025/036477 | H01L 25/16 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015396 | HIGH DIE STACK PACKAGE WITH SECONDARY INTERPOSER | US2025/036483 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015398 | HIGH DIE STACK PACKAGE WITH MODULAR STRUCTURE | US2025/036492 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015399 | ETCHING APPARATUS THAT OSCILLATE WAFERS DURING ETCHING | US2025/036493 | H01L 21/67 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015402 | DEVICES AND METHODS INVOLVING THERMALLY-CONDUCTIVE DEVICES USING SUBSTRATE | US2025/036510 | H01L 23/373 | THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015403 | NITRIDE LAYER FORMATION BY CYCLIC DEPOSITION AND TREATMENT | US2025/036516 | H01L 21/02 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015408 | SYSTEMS FOR TRANSPORTING A PLURALITY OF SEMICONDUCTOR STRUCTURES, WAFER BOATS AND METHODS FOR HEATING A SET OF SEMICONDUCTOR STRUCTURES | US2025/036559 | H01L 21/673 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015436 | PARTICLE DEFECT PREDICTION AND CORRECTION BASED ON PROCESS CHAMBER MODELING | US2025/036618 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015437 | METHODS TO ENHANCE AND CHARACTERIZE OXYGEN PRECIPITATION INDUCED DEFECTS DURING A WAFER POLISHING SEQUENCE | US2025/036619 | H01L 21/66 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015584 | CHAMBER BODY WITH TRENCH FOR RF TRANSMISSION LINES | US2025/036888 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015594 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING A DISPLAY APPARATUS | US2025/036911 | H01L 25/075 | CORNING INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 03 | WO/2026/015619 | METHODS OF PROCESSING SEMICONDUCTOR-ON-INSULATOR STRUCTURES USING CLEAN-AND-ETCH OPERATION | US2025/036949 | H01L 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